The system is capable of thin film deposition using PVD methods including electron beam evaporation, molecular beam deposition, sputter deposition and thermal evaporation methods. Additionally, in-situ characterisation techniques include angle-resolved
monochromatic X-ray and ultraviolet photoelectron spectroscopy, scanning auger electron spectroscopy, atomic force and scanning tunnelling microscopy/spectroscopy.
The system utilises 100 mm diameter wafers (for cleanroom process compatibility), and modified sample plates for the various deposition and characterisation techniques. Wafers are transported throughout the system in a UHV transfer system. Each deposition module has heating and rotational capability for the study of film uniformity and growth kinetics. Moreover, the system is expandable. The design permits the extension of the system to accommodate even more deposition or analytical techniques.